Product Name
Thermally Conductive Silicone Encapsulant
OSiTC 3300
Product Characteristics
● High thermal conductivity
● Excellent dielectric property and good resistance to high and low temperature
● Excellent chemical stability
● The internal stress is small, and the damage to the components is minimized
● Room temperature curing, high-temperature use
Application Field
It is suitable for all kinds of electronic components of heat conduction, potting, pouring, and bonding.
Technical Index
Operation Precautions
This glue liquid group A is divided into the original package after mixing evenly (can be pre-baked at 60 degrees for 30 minutes at low temperature), and then Group A and Group B are divided into the prescribed weight ratio of mixing and mixing evenly before use. After mixing, the operation should be carried out within the operable time, otherwise the viscosity of the glue will increase, reduce the flow of the glue and affect the use effect.
This product manual is the basic information. and product performance improvements, product specifications, etc. are subject to change without notice. Our company guarantees that the products meet the specifications, but due to the differences in the customer's use conditions and the process is not under the control of our company, the customer must test it first to confirm whether it is suitable for your application. The performance parameters of the products can be adjusted according to the customer's requirements.
