Introducing the OSiTC 3300 Heat Conductive Encapsulant – the ultimate solution for efficient thermal management in your electronic devices. Engineered to meet the demands of high-performance applications, this advanced encapsulant combines exceptional heat dissipation properties with reliable protection for sensitive electronic components.
Product Name
Thermally Conductive Silicone Encapsulant OSiTC 3300
Thermal Silicone Potting Material Characteristics
● High thermal conductivity
● Excellent dielectric property and good resistance to high and low temperature
● Excellent chemical stability
● The internal stress is small, and the damage to the components is minimized
● Room temperature curing, high-temperature use
Key Features:
● High Thermal Conductivity: The OSiTC 3300 boasts an impressive thermal conductivity rating, ensuring rapid heat transfer away from critical areas, thereby enhancing device performance and longevity.
● Excellent Encapsulation: This encapsulant provides comprehensive coverage, protecting your circuitry from environmental hazards such as moisture, dust, and mechanical shocks without compromising on thermal efficiency.
● Ease of Application: Designed for user convenience, the OSiTC 3300 can be easily applied through various methods, including dispensing, screen printing, or injection molding, facilitating seamless integration into your manufacturing process.
● Versatile Compatibility: Suitable for a wide range of substrates and materials, the OSiTC 3300 ensures compatibility with most common electronic components, making it a versatile choice for diverse applications.
● Durable and Reliable: With its robust formulation, this encapsulant maintains its structural integrity over time, even under harsh operating conditions, ensuring sustained performance and reliability.
Thermal Silicone Potting Material Application Field
It is suitable for all electronic heat conduction, potting, pouring, and bonding components.
Thermal Silicone Potting Material Technical Index
| Before cure | Appearance | adhesive A | White viscous fluid |
| adhesive B | Transparent fluid |
| Viscosity (cps40℃) | A | 120000 |
| B | 80 |
| Mixing ratio(weight ratio) | 25:11 |
| Operational time (hr,25°C) | 1.5~2H |
| Complete cure (hr,25°C) | 24H |
| Complete cure(hr,60°C) | 2~3H |
| After cure | Temperature range (℃) | -40~+200 |
| Hardness (Shore D) | >80 |
| Breakdown voltage (kv/mm) | >25 |
| Thermal conductivity (w/m·k) | 3.0 |
| Volume resistance (Ω·cm) | >1014 |
Thermal Silicone Potting Material Operation Precautions
This glue liquid group A is divided into the original package after mixing evenly (can be pre-baked at 60 degrees for 30 minutes at low temperature), and then Group A and Group B are divided into the prescribed weight ratio of mixing and mixing evenly before use. After mixing, the operation should be carried out within the operable time, otherwise, the viscosity of the glue will increase, reduce the flow of the glue and affect the use effect.
This product manual is the basic information. and product performance improvements, product specifications, etc. are subject to change without notice. Our company guarantees that the Thermal Silicone Potting Materials meet the specifications, but due to the differences in the customer's use conditions and the process is not under the control of our company, the customer must test it first to confirm whether it is suitable for your application. The performance parameters of the Heat Conductive Encapsulant can be adjusted according to the customer's requirements.
The OSiTC 3300 Heat Conductive Encapsulant stands out as a top-tier solution for engineers and designers seeking to optimize thermal performance while ensuring the protection and reliability of their electronic devices. Experience the perfect blend of thermal efficiency and durability with OSiTC 3300 – your partner in achieving unparalleled thermal management excellence.
