Product Name
Thermally Conductive Silicone Encapsulant
OSiTC 2400L
Product Description
OSiTC 2400L Thermal conductivity adhesive is a two-component silicone high thermal conductivity potting composite, with high thermal conductivity and electrical properties:
1) Low stress. When curing, the shrinkage rate is low and the stress is small.
2) Good durability. The matrix is formed from organic silicone rubber with outstanding heat resistance.
3) Low viscosity. The viscosity of potting adhesive is low, which is suitable for vacuum potting. It can ensure the consistency of potting parts and high yield.
4) Strong environmental tolerance. Excellent shock resistance.
Properties
Caution
1) Before weighing, the two components of A and B need to be fully stirred;
2) According to the proportion of the quality ratio A: B = 1: 1, the component A and B shall not exceed 3%;
3) Plates A and B are fully mixed and evenly mixed in the container. The amount of rubber should not exceed 1/2 of the container, and the mixed rubber should be used in 120min;
4) Vacuum foaming 2-3 times (vacuum-0.1MPa), 5-10min each time;
5) The rubber material should be sealed storage, especially after the opening of the B component
must be sealed to prevent moisture absorption affecting the curing effect;
6) Adhesive contact with the following substances will reduce the curing speed or even not cure:
a) N, P, S organic compounds;
b) Sn, Pb, Hg, As plasma compounds;
c) Alkynes and polyvinyl compounds.
7) This product should be tried before batch use to meet the requirements before applying.
8) If the repaired device is cleaned with solvent, it needs to be vacuum-dried and then pot-sealed. The residual solvent may affect the curing condition of the product.
Storage
1) The storage period of component B is 4 months under the condition of sealed condition and temperature below 25℃. Under other storage conditions, it is necessary to do a small test before use to observe the curing condition.
2) After component B is unsealed, the remaining component B shall be sealed in time and stored away from light. It is recommended to use up the remaining component B within 10 days, and component B shall be unsealed for more than 10 days. Before use, a small test shall be conducted to observe the curing condition.
3) The storage period of component A is 6 months under the condition of sealed condition and temperature below 25℃. Under other storage conditions, it is necessary to do a small test before use to observe the curing condition.
4) After component A is unsealed, the remaining component A should be sealed in time, which is recommended to be used up within 30 days. If component A is unsealed for more than 30 days, A small test should be done before use to observe the curing condition.
Other Specifications
According to the needs of users, other specifications of organic silicon, epoxy, and polyurethane thermal insult electronic glue with a thermal conductivity is less than 3.2W/m · k. It can also provide thermal grease with thermal conductivity greater than 5.0W/m·K.
Attached: Technical Indexes of other Thermally Conductive Potting Compound
This product manual is the basic information. The product performance improvements, product specifications, etc. are subject to change without notice. Our company guarantees that the products meet the specifications, but due to the differences in the customer's use conditions and the process is not under the control of our company, the customer must test it first to confirm whether it is suitable for your application. The performance parameters of the products can be adjusted according to the customer's requirements.
