Product Name
Thermally Conductive Silicone Encapsulant
OSiTC 2070C
Product Characteristics
OSiTC 2070C Thermal conductivity adhesive is organosilicon material, with superior high and low temperature resistance and UV resistance, aging resistance, high thermal conductivity, superior dielectric properties and excellent chemical stability. It has low stress and can be disassembled for easy repair. Cure at room temperature and use at high temperature.
Technical Index
Application Field
It is suitable for heat conduction, insulation and sealing of various electronic components, such as various modules, transformers, electrical appliances, instruments, automobiles and other industries.
Instruction
1. Before use, fully stir group A, because stratified precipitation may occur in the process of transportation and storage due to the influence of gravity. If insufficient stirring is used, the product may be more or less incomplete curing due to some components.
2. After group A is fully stirred, pour into Group B, according to A: B (weight ratio) = 10:1. After mixing, stir fully before carrying out relevant operations.
Note: Be sure to match by weight ratio.
This product manual is the basic information. The product performance improvements, product specifications, etc. are subject to change without notice. Our company guarantees that the products meet the specifications, but due to the differences in the customer's use conditions and the process is not under the control of our company, the customer must test it first to confirm whether it is suitable for your application. The performance parameters of the products can be adjusted according to the customer's requirements.
