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Thermally Conductive Encapsulants

OSiTC 2070 Thermally Conductive Silicone Encapsulant

Thermally Conductive Silicone Encapsulant 

OSiTC 2070

Description

Product Name

Thermally Conductive Silicone Encapsulant

OSiTC 2070


Product Characteristics

OSiTC 2070 Silicone encapsulant is an addition molding silicone material that cures at room temperature/temperature. This two-component elastomeric silicone is designed to pot and protect electronics under harsh conditions.

OSiTC 2070 Silicone encapsulants use a new technology that cures well without heating. After thoroughly mixing the A and B components in a ratio of 1:1(weight or volume ratio) during use, the product cures over a certain period of time to form an elastic cushioning material. Cured elastomers have the following properties:

  • Resistant to moisture, dirt and other atmospheric components

  • Reduces mechanical stress and tension caused by mechanical, thermal shock and vibration

  • Easy to patch

  • Good high-frequency electrical performance

  • No solvents, no curing by-products

  • Can be used between -50~250°C

  • Excellent flame retardancy


General Performance

OSiTC 2070 Thermally Conductive Silicone Encapsulant


Operation Process

OSiTC 2070 Thermally Conductive Silicone Encapsulant

(1) The operation time is tested by the amount of 100g OSiTC 2070.

Take out the two components of A and B in proportion, stir and mix evenly, remove air bubbles in a vacuum, and pour them on the product to be potted during the operation period (80℃/30min or 25℃/12hr). If the potting product is too large, it is recommended to fill it in parts.


Operational Precautions

1. OSiTC 2070 is recommended to stir the A and B components evenly before taking them and pay attention to sealing and storing them after use.

2. When stirring, attention should be paid to stirring in the same direction, otherwise too many bubbles will be mixed, and the OSiTC 2070 material at the frame and bottom of the container should also be stirred evenly, otherwise there will be a local non-curing phenomenon caused by uneven stirring.

3. Pouring on the product and vacuuming again to remove air bubbles can improve the comprehensive performance of the cured product.

4. If the temperature is too low, the curing speed will be slow, so it is recommended to cure by heating.

5. OSiTC 2070 will be difficult to cure or not in contact with materials containing tin, sulfur, amine and other materials.


Typical Performance

OSiTC 2070 Thermally Conductive Silicone Encapsulant

Note: All of the above data were measured after 7 days of curing at 25°C, 55%RH.


Packing Specifications

A: 10kg/drum B: 10kg/drum


Storage and Transportation

1. Components A and B need to be protected from light, heat and sealed (can be transported and stored as non-dangerous goods);

2. Storage period 2 years (25°C).


Safety Operation Information

Product safety information is not included here. Please read the product information, product safety information and package label for safe use before use. Product safety information can be obtained from us.


Quality Assurance Certificate - Please Read It Carefully 

  • We guarantee that the product performance and usage information contained herein is accurate and reliable. However, you should still test its performance, safe use, etc. before using it. Recommendations applied cannot be considered applicable in any state.

  • Unless we provide a written certificate of suitability for a particular need, we only warrant the specifications set forth in the sales brochure of the product and not any other use. The sole responsibility of the company is to give a refund or exchange if the product does not meet the listed requirements, and the company expressly states that it will not be responsible for accidents.  

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